Removal of Copper Contamination from Slurry Used in CMP...

Removal of Copper Contamination from Slurry Used in CMP Process of Semiconductor Manufacturing

Yonehara, Takahiro, Yoshida, Chika, Iiyama, Masamitsu, Abe, Mitsugu, Toda, Masayuki
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Volume:
18
Year:
2007
Journal:
Journal of Ion Exchange
DOI:
10.5182/jaie.18.610
File:
PDF, 853 KB
2007
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