[IEEE 2019 Electrical Design of Advanced Packaging and...

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[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - Reduction of Common-Mode Noise in Bent Differential Interconnects for PAM4 Signaling

Deroo, Andries, Huynen, Martijn, Rogier, Hendrik, Van den Brande, Quinten, Ginste, Dries Vande, Chan, Hao-Wei, Wu, Ruey-Beei
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Year:
2019
DOI:
10.1109/EDAPS47854.2019.9011682
File:
PDF, 547 KB
2019
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