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[IEEE 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hangzhou, China (2019.7.2-2019.7.5)] 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) - Silicon Precipitates Counts and Size Study in Aluminium Bond Pads
Lee, Lim Wei, Azlin MohdNoor, Mohamad Esa, Raj, Marks MichaelYear:
2019
DOI:
10.1109/ipfa47161.2019.8984865
File:
PDF, 3.34 MB
2019