[IEEE 2019 IEEE CPMT Symposium Japan (ICSJ) - Kyoto, Japan (2019.11.18-2019.11.20)] 2019 IEEE CPMT Symposium Japan (ICSJ) - Panel Level Packaging - From Idea to Industrialization -
Braun, T., Schneider-Ramelow, M., Lang, K.-D., Becker, K.-F., Hoelck, O., Voges, S., Boettcher, L., Topper, M., Stobbe, L., Aschenbrenner, R., Voitel, M.Year:
2019
DOI:
10.1109/icsj47124.2019.8998753
File:
PDF, 4.96 MB
2019