![](/img/cover-not-exists.png)
[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Picosecond Laser Structuring Technology for LTCC - the Improvement of Fine Line Structuring
Gutzeit, N., Schulz, A., Fischer, M., Thelemann, T., Muller, J.Year:
2019
DOI:
10.23919/EMPC44848.2019.8951813
File:
PDF, 3.54 MB
2019