![](/img/cover-not-exists.png)
[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Alternative Heating Methods for Printed Circuit Boards and a Practical Comparison of Direct Resistance and Inductive Heating Processes
Seehase, Dirk, Neiser, Arne, Maxa, Jacob, Lange, Fred, Novikov, Andrej, Nowottnick, MathiasYear:
2019
DOI:
10.23919/EMPC44848.2019.8951823
File:
PDF, 1.28 MB
2019