[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Inspection / Metrology Evaluation of Fine Pitch Test Vehicles for Advanced Packages
Xue, Feng, Zou, Joe, Han, Cindy, Reynolds, Charles, Wassick, Thomas, Pomerantz, Glenn, Frankel, Jason, Bonam, Ravi, Woychik, Charles, Tsuriya, MasahiroYear:
2019
DOI:
10.23919/icep.2019.8733543
File:
PDF, 1.99 MB
2019