MIM Surface Reconditioning Under Knudsen Flow During Metal...

IEEE Transactions on Semiconductor Manufacturing 2019 / 11 Vol. 32; Iss. 4

MIM Surface Reconditioning Under Knudsen Flow During Metal Deposition Process

Weng, Chang'e, Yang, Jinhong, Rivers, Tertius, Tesauro, Mark
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Volume:
32
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/TSM.2019.2944780
Date:
November, 2019
File:
PDF, 3.86 MB
2019
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