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MIM Surface Reconditioning Under Knudsen Flow During Metal Deposition Process
Weng, Chang'e, Yang, Jinhong, Rivers, Tertius, Tesauro, MarkVolume:
32
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/TSM.2019.2944780
Date:
November, 2019
File:
PDF, 3.86 MB
2019