Electromigration Effects in Power Grids Characterized From a 65 nm Test Chip
Zhou, Chen, Fung, Rita, Wen, Shi-Jie, Wong, Richard, Kim, Chris H.Volume:
20
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2019.2956158
Date:
March, 2020
File:
PDF, 1.25 MB
2020