[IEEE 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hangzhou, China (2019.7.2-2019.7.5)] 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) - Metallic Trace Contaminant Detection Using SEM/EDX
Lee, Aaron, Zee, Bernice, Foo, Fang JieYear:
2019
DOI:
10.1109/ipfa47161.2019.8984856
File:
PDF, 1.17 MB
2019