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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Comprehensive Study of Tin-Silver-Copper Lead-Free Alloys on Various Bond Pad Metallisation
Jaafar, Norhanani Binte, Choong, Chong SerYear:
2019
DOI:
10.1109/EPTC47984.2019.9026678
File:
PDF, 2.61 MB
2019