[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Numerical Investigation on Heat Transfer Enhancement with Perforated Square Micro-Pin Fin Heat Sink for Electronic Cooling Application
Gupta, Deepa, Saha, Probir, Roy, SomnathYear:
2019
DOI:
10.1109/EPTC47984.2019.9026623
File:
PDF, 3.46 MB
2019