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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Carbon Nanotube for Interconnects and Nano-Packaging Application
Siah, Chun Fei, Wang, Jianxiong, Roux-Levy, Philippe, Coquet, Philippe, Tay, Beng Kang, Baillargeat, DominiqueYear:
2019
DOI:
10.1109/EPTC47984.2019.9026662
File:
PDF, 6.51 MB
2019