[IEEE 2019 14th International Microsystems, Packaging,...

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[IEEE 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2019.10.23-2019.10.25)] 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Minimizing Power Module Size with Low Stray Inductance and High Heat Dissipation

Wu, Chih-Chiang, Ho, Cheng-Han, Hsieh, Shih-Kai, Lin, Li-Song, Peng, Ming-Tsan
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Year:
2019
DOI:
10.1109/IMPACT47228.2019.9024970
File:
PDF, 4.72 MB
2019
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