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[IEEE 2020 IEEE/SICE International Symposium on System Integration (SII) - Honolulu, HI, USA (2020.1.12-2020.1.15)] 2020 IEEE/SICE International Symposium on System Integration (SII) - 3D Model-Based Assembly Sequence Optimization using Insertionable Properties of Parts
Tariki, Kento, Kiyokawa, Takuya, Ricardez, Gustavo Alfonso Garcia, Takamatsu, Jun, Ogasawara, TsukasaYear:
2020
Language:
english
DOI:
10.1109/SII46433.2020.9026210
File:
PDF, 1.67 MB
english, 2020