[IEEE 2019 IEEE International Ultrasonics Symposium (IUS) - Glasgow, United Kingdom (2019.10.6-2019.10.9)] 2019 IEEE International Ultrasonics Symposium (IUS) - Wafer bonded CMUT technology utilizing a Poly-Silicon-on-Insulator wafer
Havreland, Andreas Spandet, Engholm, Mathias, Grass, Rune Sixten, Arendt Jensen, Jorgen, Thomsen, Erik VilainYear:
2019
Language:
english
DOI:
10.1109/ultsym.2019.8925931
File:
PDF, 14.58 MB
english, 2019