Failure Analysis of SAC305 Ball Grid Array Solder Joint at...

Applied Sciences 2020 / 03 Vol. 10; Iss. 6

Failure Analysis of SAC305 Ball Grid Array Solder Joint at Extremely Cryogenic Temperature

Li, Yanruoyue, Yan, Xiaojun, Fu, Guicui, Wan, Bo, Jiang, Maogong, Zhang, Weifang
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Volume:
10
Language:
english
Journal:
Applied Sciences
DOI:
10.3390/app10061951
Date:
March, 2020
File:
PDF, 7.36 MB
english, 2020
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