[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Enabling Cu Pillar Flip Chip Assembly with Water Soluble Lead-free Solder Paste
Kumar, B. Senthil, Danila, Bayaras Abito, Joanne, Chong Mei Hoe, Fen, Zhang Rui, Rath, Santosh Kumar, Li-San, Chan, Jason, Wong Chin YeungYear:
2019
Language:
english
DOI:
10.1109/EPTC47984.2019.9026676
File:
PDF, 2.63 MB
english, 2019