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[IEEE 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Cluj-Napoca, Romania (2019.10.23-2019.10.26)] 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Preventing the Temperature Side Channel Attacks on Security Circuits
Vasile, Daniel-Ciprian, Svasta, Paul, Pantazica, MihaelaYear:
2019
Language:
english
DOI:
10.1109/siitme47687.2019.8990788
File:
PDF, 4.32 MB
english, 2019