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Sintering mechanism of supersaturated Ag-Cu nanoalloy film for power electronic packaging
Jia, Qiang, Zou, Guisheng, Wang, Wengan, Ren, Hui, Zhang, Hongqiang, Deng, Zhongyang, Feng, Bin, Liu, LeiLanguage:
english
Journal:
ACS Applied Materials & Interfaces
DOI:
10.1021/acsami.9b20731
Date:
March, 2020
File:
PDF, 2.45 MB
english, 2020