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[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - Design of Wideband Functional Via Structures for LTCC Multilayer Substrates up to 110 GHz
Yildiz, Omer F., Schuster, ChristianYear:
2019
Language:
english
DOI:
10.1109/EDAPS47854.2019.9011681
File:
PDF, 1.38 MB
english, 2019