[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Die Attachment on Bare Copper Surface by Non-Pressure Silver Sintering in Inert Atmosphere
Chew, Ly May, Stegmann, Tamira, Schwenk, Erika, Schmitt, WolfgangYear:
2019
Language:
english
DOI:
10.1109/EPTC47984.2019.9026669
File:
PDF, 12.70 MB
english, 2019