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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Thermal Characteristic Evaluation of Silver and Copper Sintering Materials
Murayama, Kei, Ota, Hiroko, Oi, KiyoshiYear:
2019
Language:
english
DOI:
10.1109/EPTC47984.2019.9026702
File:
PDF, 3.16 MB
english, 2019