![](/img/cover-not-exists.png)
[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Die Sticking Quality Issue of Tape-and-Reel Packaging for WLCSP
Khine, Lynn, Alimagno, Joel C.Year:
2019
Language:
english
DOI:
10.1109/eptc47984.2019.9026568
File:
PDF, 1.10 MB
english, 2019