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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Achieving of aluminumâaluminum wafer bonding at low temperature and pressure using Surface passivated technique
Bonam, Satish, Kumar, C Hemanth, Vanjari, Siva Rama Krishna, Singh, Shiv GovindYear:
2019
Language:
english
DOI:
10.1109/eptc47984.2019.9026587
File:
PDF, 4.64 MB
english, 2019