[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - Power Integrity Comparison of Off-chip, On-interposer, On-chip Voltage Regulators in 2.5D/3D ICs

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