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[IEEE 2019 IEEE International Electron Devices Meeting (IEDM) - San Francisco, CA, USA (2019.12.7-2019.12.11)] 2019 IEEE International Electron Devices Meeting (IEDM) - Reverse tip sample scanning for precise and high-throughput electrical characterization of advanced nodes
Celano, U., Paredis, K., Vandervorst, W., der Heide, P. van, Hantschel, T., Boehme, T., Kanniainen, A., Wouters, L., Bender, H., Bosman, N., Drijbooms, C., Folkersma, S.Year:
2019
Language:
english
DOI:
10.1109/iedm19573.2019.8993661
File:
PDF, 374 KB
english, 2019