[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Behaviour of Silver-Sintered Joints by Cyclic Mechanical Loading and Influence of Temperature
Gokdeniz, Zeynep, Khatibi, Golta, Nicolics, Johann, Steiger-Thirsfeld, AndreasYear:
2019
Language:
english
DOI:
10.23919/EMPC44848.2019.8951762
File:
PDF, 3.82 MB
english, 2019