[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Triple-Stacked Wafer-to-Wafer Hybrid Bonding for 3D Structured Image Sensors
Honda, Yuki, Goto, Masahide, Watabe, Toshihisa, Nanba, Masakazu, Iguchi, Yoshinori, Saraya, Takuya, Kobayashi, Masaharu, Higurashi, Eiji, Toshiyoshi, Hiroshi, Hiramoto, ToshiroYear:
2019
Language:
english
DOI:
10.23919/LTB-3D.2019.8735257
File:
PDF, 5.24 MB
english, 2019