[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Comprehensive Design and Analysis of Fan-Out Wafer Level Package
Zhang, Xiaowu, Andriani, Yosephine, Jong, Ming Chinq, Bu, Lin, Lau, Boon Long, Boon, Simon Lim Siak, Siang, Sharon Lim Pei, Han, Yong, Liu, Songlin, Wang, XiaobaiYear:
2019
Language:
english
DOI:
10.1109/EPTC47984.2019.9026620
File:
PDF, 5.96 MB
english, 2019