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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Adhesion Strength and Warpage Behaviors of Advanced Package Substrate by Light-source Irradiation
Park, Jong-Young, Ahn, Eun-Chul, Youm, Kwang-Seop, Yoon, Kwan-Sun, Shin, Young-Hwan, Noh, Joo-Hyoung, Kim, Young-JaeYear:
2019
Language:
english
DOI:
10.1109/EPTC47984.2019.9026634
File:
PDF, 2.66 MB
english, 2019