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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Die-to-wafer Bonding: Comparison of Designing, Processing and Assembling of Different Approaches
Xie, Ling, Li, Hongyu, Chong, Ser Choong, Ren, QinYear:
2019
Language:
english
DOI:
10.1109/EPTC47984.2019.9026650
File:
PDF, 1.50 MB
english, 2019