Microstructures, interface reaction, and properties of...

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  • Microstructures, interface reaction, and properties of...
Journal of Materials Science: Materials in Electronics 2020 / 3

Microstructures, interface reaction, and properties of Sn–Ag–Cu and Sn–Ag–Cu–0.5CuZnAl solders on Fe substrate

Zhang, Liang, Long, Wei-min, Wang, Feng-jiang
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Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-020-03220-1
Date:
March, 2020
File:
PDF, 2.18 MB
english, 2020
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