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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Co-Design of High-Isolation Chip-Package-Board in eWLB Package for 77 GHz Automotive Radar Application
Zhu, Chuanming, Duan, Zongming, Wang, Yan, Liu, Ying, Dai, YuefeiYear:
2019
Language:
english
DOI:
10.1109/EPTC47984.2019.9026665
File:
PDF, 3.94 MB
english, 2019