[IEEE 2018 IEEE 20th Electronics Packaging Technology...

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[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Modeling and Control of Hybrid Si-Based Micro-Fluid Cooling System for Data Center Application

Chen, Haoran, Han, Yong, Tang, Gongyue, Zhang, Xiaowu
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Year:
2018
Language:
english
DOI:
10.1109/eptc.2018.8654447
File:
PDF, 4.40 MB
english, 2018
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