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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Chemical and Temperature Resistance of PIB-Based Temporary Adhesives
Zigmond, Jennifer, Gray, Allison, Moore, JohnYear:
2019
Language:
english
DOI:
10.1109/EPTC47984.2019.9026601
File:
PDF, 1.25 MB
english, 2019