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[IEEE 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2019.10.23-2019.10.25)] 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Epoxy Resin Encapsulated IGBT Module Characteristics and Reliability
Chen, Yu-Ju, Chen, Hao-Chih, Chi, Wei-Hao, Hsu, Hao-Chiang, Lu, Ken-Cheng, Liao, Hsueh-KuoYear:
2019
Language:
english
DOI:
10.1109/IMPACT47228.2019.9024973
File:
PDF, 3.02 MB
english, 2019