THERMAL CONDUCTIVITY AND THERMAL AGING PERFORMANCE OF Sn...

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Surface Review and Letters 2019 / 08

THERMAL CONDUCTIVITY AND THERMAL AGING PERFORMANCE OF Sn WITH 0.7 wt.% Cu and VARIOUS GRAPHENE ADDITIONS

SUN, CAIXIA, ZHANG, FENGYUN, ZHANG, HONGXIA, ZHANG, NIANLONG, LI, SHOUYING, DAI, JINGJIE, ZHANG, HAILONG
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Language:
english
Journal:
Surface Review and Letters
DOI:
10.1142/s0218625x19501610
Date:
August, 2019
File:
PDF, 2.28 MB
english, 2019
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