[IEEE 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hangzhou, China (2019.7.2-2019.7.5)] 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) - Application of Nano-indentation method to characterize adhesion strength of polyimide film
LI, Xiaoxuan, ZHU, Xintong, LIU, Yi, LI, Xiaodong, CHOCKALINGAM, Ramasamy, NISTALA, Ramesh Rao, Qiang MO, ZhiYear:
2019
Language:
english
DOI:
10.1109/ipfa47161.2019.8984895
File:
PDF, 6.53 MB
english, 2019