[IEEE 2019 IEEE 26th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Hangzhou, China (2019.7.2-2019.7.5)] 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) - Case Study on Precise Boron Quantification of Mixed Matrix
Ong, Kian Kok, Wang, Yun, Teo, Han Wei, Rao Nistala, Ramesh, Mo, Zhi QiangYear:
2019
Language:
english
DOI:
10.1109/ipfa47161.2019.8984874
File:
PDF, 1.51 MB
english, 2019