Reconstituted Wafer Deformation Analysis Through Whole...

IEEE Transactions on Device and Materials Reliability 2020 / 3 Vol. 20; Iss. 1

Reconstituted Wafer Deformation Analysis Through Whole Process Emulation

Yang, Cheng-Ying, Chen, Kuo-Shen, Yang, Tian-Shiang
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Volume:
20
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2020.2972888
Date:
March, 2020
File:
PDF, 1.92 MB
english, 2020
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