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Structural and transport properties of Cu/Ta(N)/Cu interfaces in vertical interconnects
Lanzillo, Nicholas A., Clevenger, Lawrence, Robison, Robert R., Edelstein, Daniel C.Volume:
127
Language:
english
Journal:
Journal of Applied Physics
DOI:
10.1063/1.5143741
Date:
March, 2020
File:
PDF, 6.07 MB
english, 2020