Fatigue mechanism of die-attach joints in IGBTs under...

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IEEE Transactions on Industrial Electronics 2020

Fatigue mechanism of die-attach joints in IGBTs under low-amplitude temperature swings based on 3D electro-thermal-mechanical FE simulations

Huang, Yongle, Deng, Hongfei, Luo, Yifei, Xiao, Fei, Liu, Binli, Tang, Xin
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Year:
2020
Language:
english
Journal:
IEEE Transactions on Industrial Electronics
DOI:
10.1109/TIE.2020.2977563
File:
PDF, 2.24 MB
english, 2020
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