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[IEEE 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Cluj-Napoca, Romania (2019.10.23-2019.10.26)] 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) - Study of Modification of Conductive Adhesive by Nanoparticles and Aging of Modified Adhesive
Mach, Pavel, Barto, SebaYear:
2019
Language:
english
DOI:
10.1109/siitme47687.2019.8990752
File:
PDF, 565 KB
english, 2019