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[IEEE 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Pisa, Italy (2019.9.16-2019.9.19)] 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) - A novel DAF Solo Mount Method for SDBG Process
Fumita, Yusuke, Takyu, Shinya, Uemichi, Atsushi, Yomogida, Kunio, Tazawa, Tsuyoshi, Ozaki, YoshinobuYear:
2019
Language:
english
DOI:
10.23919/EMPC44848.2019.8951881
File:
PDF, 728 KB
english, 2019