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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Generation of 3-dimensional power modules for high temperature applications by thermal copper coating processes
Hensel, Alexander, Schwarzer, Christian, Merz, Corinna, Stoll, Thomas, Kaloudis, Michael, Franke, JoergYear:
2019
DOI:
10.1109/eptc47984.2019.9026619
File:
PDF, 1.51 MB
2019