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[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Development of FCBGA substrate with low Dk/Df material based on automotive reliability conditions
Lee, ShinKi, Lee, HanSung, Lim, HunJung, Hwang, InSeok, Jung, WooYong, Ma, ChangWon, Lee, DongSu, Jung, YounHo, Lee, DaeShin, Han, SangWook, Ahn, Eun-Chul, Shin, YoungHwanYear:
2019
DOI:
10.1109/eptc47984.2019.9026708
File:
PDF, 1.50 MB
2019