[IEEE 2019 14th International Microsystems, Packaging,...

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[IEEE 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2019.10.23-2019.10.25)] 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - 6-DoF Force/Torque Sensor

Lin, Chih-Che, Su, Chung-Yuan, Lin, Shih-Ting, Chen, Chih-Yuan, Yeh, Chien-Nan, Lin, Chih-Hsiou, Wang, Ling-Wen, Kuo, Shiou-Yi, Chien, Laing-Ju
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Year:
2019
DOI:
10.1109/impact47228.2019.9024986
File:
PDF, 751 KB
2019
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