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Metals and Materials International 2020 / 3

Effect of Wire-Drawing Process Conditions on Secondary Recrystallization Behavior During Annealing in High-Purity Copper Wires

Park, Hyun, Kim, Sang-Hyeok, Lee, Woo-Jin, Ha, Jung-Won, Kim, Se-Jong, Lee, Hyo-Jong
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Journal:
Metals and Materials International
DOI:
10.1007/s12540-020-00682-0
Date:
March, 2020
File:
PDF, 6.38 MB
2020
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