Copper matrix thermal conductive composites with low...

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Ceramics International 2020 / 4

Copper matrix thermal conductive composites with low thermal expansion for electronic packaging

Gao, Shuai, Nan, Zongliang, Li, Yi, Zhao, Nan, Liu, Qinqin, Xu, Guifang, Cheng, Xiaonong, Yang, Juan
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Journal:
Ceramics International
DOI:
10.1016/j.ceramint.2020.04.117
Date:
April, 2020
File:
PDF, 4.19 MB
2020
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